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2026-09-08
Review on Preparation, Modification and Application of High‑Purity Aluminum Nitride Powder
Review on Preparation, Modification and Application of High‑Purity Aluminum Nitride Powder
2026-09-07
SUOYI Research Progress on Preparation Technology and Industrialization of Aluminum Nitride Powder
Research Progress on Preparation Technology and Industrialization of Aluminum Nitride Powder
2026-09-03
SUOYI Spherical Thermally Conductive and Insulating Composite Powders
SUOYI Spherical Thermally Conductive and Insulating Composite Powders
2026-08-27
SUOYI researches and produces Spherical thermal spray powder.
The particles are spherical powders specifically designed for thermal spraying processes such as plasma spraying and high-velocity oxygen fuel (HVOF) spraying.
Advantages: Good flowability, stable powder delivery, high bulk density, and dense, uniform coating.
Advantages: Good flowability, stable powder delivery, high bulk density, and dense, uniform coating.
2026-08-24
Market Size and Development Trends of High Thermal Conductivity Insulating Fillers
High thermal conductivity insulating inorganic fillers (alumina, aluminum nitride, boron nitride, silicon nitride, etc.) are core raw materials for thermally conductive silicone, thermally conductive gel, thermally conductive pads, thermally conductive engineering plastics, and aluminum nitride ceramic substrates. Benefiting from the rapid development of power semiconductors, new energy vehicles, 5G base stations, AI computing power
2026-08-12
SUOYI Spherical Thermal Spray Powders: Key Enabling Materials for High-End Industrial Coatings
In the fields of high-end thermal spraying, surface modification, and precision protective coatings, the morphology, purity, and flowability of the powder directly determine the coating's density, wear resistance, temperature resistance, and service life. Compared to traditional irregular powders, spherical powders—characterized by their smooth, uniform shape, excellent flowability, stable feeding, high bulk density.
2026-08-03
Spherical Yttria‑Stabilized Zirconia Powder Application Fields
Spherical Yttria‑Stabilized Zirconia Powder (Spherical Y‑TZP / YSZ) features high sphericity, superior flowability and tap density, suitable for thermal spray, ceramic 3D‑printing, dry pressing & cold isostatic pressing, tape‑casting processes.
Biomedical Industry
Biomedical Industry
2026-07-24
SUOYI Multifunctional Inorganic New Material – Nano Titanium Dioxide (Nano TiO₂) Powder
Nano titanium dioxide, also known as nano-titanium oxide, is an ultrafine functional titanium dioxide powder with a particle size controlled between 5–100 nm. It mainly consists of two commercially available crystalline phases: anatase and rutile. Unlike ordinary micron-sized titanium dioxide, the nanoscale structure brings unique photocatalytic effects, broad-spectrum ultraviolet blocking, high specific surface area, and superhydrophilicity,
2026-07-22
Suoyi Silica Powder – A Crucial Basic Powder for High-Performance Inorganic Materials
Silicon oxide powder (SiO₂ powder) is a high-performance inorganic non-metallic powder material with excellent thermal stability, chemical resistance, electrical insulation properties, and low thermal expansion characteristics.
Due to its outstanding physical and chemical properties, silicon oxide powder has become an essential raw material in advanced ceramics, semiconductor packaging, electronic materials, energy storage, optical materials, and high-temperature applications.
Due to its outstanding physical and chemical properties, silicon oxide powder has become an essential raw material in advanced ceramics, semiconductor packaging, electronic materials, energy storage, optical materials, and high-temperature applications.
2026-07-20
SUOYI Aluminum Nitride Powder: A Core Powder Material for High Thermal Conductivity and Insulation in the Electronic Semiconductor Industry
SUOYI Aluminum Nitride Powder: A Core Powder Material for High Thermal Conductivity and Insulation in the Electronic Semiconductor Industry
With the comprehensive iteration of third-generation semiconductors, AI computing chips, new energy power modules, and 5G RF devices, the miniaturization, high power, and high frequency of these devices bring the dual challenges of intense heat generation and high-voltage insulation.
With the comprehensive iteration of third-generation semiconductors, AI computing chips, new energy power modules, and 5G RF devices, the miniaturization, high power, and high frequency of these devices bring the dual challenges of intense heat generation and high-voltage insulation.
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