51.37um Aluminum nitride powder (AlN powder)

Aluminum nitride powder (AlN powder)

Chemical Formula: AlN

CAS No.: 24304-00-5

  

Large-particle-size industrial economical thermally conductive and insulating filler powder, used in thermally conductive composite materials for civilian electronic products; raw materials for high-temperature refractory crucibles, evaporation boats, conventional high-temperature insulating ceramics, and wear-resistant composite ceramics in the sintering industry.

Crystal Structure: Hexagonal wurtzite (covalently bonded ceramic)

Appearance: White/off-white fine powder

Density: 3.26 g/cm³

D50: 1 μm / 5 μm / 10 μm

Decomposes and sublimates at approximately 2200℃

Core Performance (Greatest Advantage: High thermal conductivity + electrical insulation)

High thermal conductivity: Theoretically up to 320 W/(m・K), sintered ceramics can reach 170–240 W/(m・K). W/(m・K), far higher than alumina; Excellent insulation: extremely high volume resistivity, low dielectric loss, suitable for high-frequency electronics; Thermal expansion coefficient matches silicon chips, not easily cracked during temperature cycling; High mechanical strength, resistant to partial molten metal corrosion; ⚠️ Shortcomings: Powder is prone to hydrolysis and moisture absorption, requiring moisture-proof and sealed storage.

Mainstream Preparation Methods: Carbothermic Reduction Nitridation (CRN): Industrial mainstream, suitable for large-scale production of high-purity powder; Direct Nitridation of Metallic Aluminum: Simple process, relatively high impurities and oxygen content.

Main Application Areas: Sintered Aluminum Nitride Ceramic Substrates; IGBT power modules, LED heat dissipation substrates, semiconductor packaging carriers, microwave devices; Thermally Conductive Fillers (Polymer Composites): Thermally conductive silicone, thermally conductive gel, thermally conductive pads, epoxy resin potting compound, thermal ink; Special High-Temperature Components: Metal melting crucibles, corrosion-resistant parts for semiconductor equipment; Scientific Research: Precursors for wide bandgap semiconductors, thin films, and piezoelectric materials.

High-purity AlN powder
Low-oxygen AlN powder
Spherical AlN powder