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High quality 99.5% Spherical Alumina for thermal conductivity
High quality 99.5% Spherical Alumina for thermal conductivity
High quality 99.5% Spherical Alumina for thermal conductivity
High quality 99.5% Spherical Alumina for thermal conductivity
High quality 99.5% Spherical Alumina for thermal conductivity

High quality 99.5% Spherical Alumina for thermal conductivity

US $1,500.00 -US $2,000.00
  • Delivery:
  • Minimum order quantity:1
  • Supply Ability:1000.0 / Month
  • Country of Origin:Tianjin port or Any Chinese Port
  • Categories: Aluminum oxide
    • Melting point:2050 ℃
    • Boiling point:2980℃
    • Molecular Weight:102
    • Specific gravity:2.5-3.95g / cm3
    • Classification:ALUMINA
    • Grade Standard:Electron Grade
    • Grade Standard:Industrial Grade
    • Appearance:White powder
    • Application:Industrial
    • Place of Origin:CN
    • Brand Name:SuoYi
    • Purity:99%
    • Other Names:Alumina
    • EINECS No.:215-691-6
    • MF:Al2O3
    • CAS No.:1344-28-1

    High quality 99.5% Spherical Alumina for thermal conductivity

    Features:

    1)High filling: Particle size distribution is reasonable, filling efficiency as resin filler is high, and compound of low viscosity and good fluidity can be made.

    2)High thermal conductivity: Filling degree is high. Compared with the thermal conductivity of crystalline silicon, that of mixture is higher.

    3)Low wear rate: It appears spherical. It wears less on the mixer and molding tool.

    4)Electrical and moisture resistance: There is a very small content of ion impurities, such as Na and Cl, so it has good electrical and moisture resistance.

    5)Particle Morphology: Equant diameter sphere, High surface smoothness

    IMG_20190308_104828.jpg

     Main Technical Parameters of SY-QW Series Spherical Alumina Filler:

    D50(μm)Specific Surface Area(m2/g)Chemical Composition (wt/%)Bulk Density(g/cm3)L.O.I.
    (0-1100)
    SiO2(%)Fe2O3(%)T-Na2O(%)EC(μS/cm)Na+(ppm)Cl-(ppm)
    QW-033±0.50.7≤0.10≤0.03≤0.015≤8≤8≤11.0≤0.03
    QW-055±10.6≤0.10≤0.03≤0.015≤8≤8≤11.3≤0.03
    QW-109±10.4≤0.10≤0.03≤0.015≤8≤8≤11.6≤0.03
    QW-2020±10.2≤0.05≤0.02≤0.01≤6≤6≤0.52.1≤0.02
    QW-3028±20.2≤0.05≤0.02≤0.01≤5≤6≤0.52.1≤0.02
    QW-4540±20.2≤0.05≤0.02≤0.01≤3≤6≤0.52.2≤0.02

    _04.png

    1)Heat sink: radiating substrate filler, heat sinking oil, phase change film

    2)Semiconductor filler

    3)Special air abrasive

    4)Organosilicon heat sinking adhesive and mixture filler

    5)Ceramic filter membrane 6)Coated powder, etc.

     
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