High Purity Aluminum oxide Al2O3 for Semiconductor filler
1)High filling: Particle size distribution is reasonable, filling efficiency as resin filler is high, and compound of low viscosity and good fluidity can be made.
2)High thermal conductivity: Filling degree is high. Compared with the thermal conductivity of crystalline silicon, that of mixture is higher.
3)Low wear rate: It appears spherical. It wears less on the mixer and molding tool.
4)Electrical and moisture resistance: There is a very small content of ion impurities, such as Na and Cl, so it has good electrical and moisture resistance.
5)Particle Morphology: Equant diameter sphere, High surface smoothness
Main Technical Parameters of SY-QW Series Spherical Alumina Filler:
|D50(μm)||Specific Surface Area(m2/g)||Chemical Composition (wt/%)||Bulk Density(g/cm3)||L.O.I.|